The relationship between chips and wafers is different from integrated circuits

The relationship between a chip and an integrated circuit is that a chip is a specific realization of an integrated circuit.wafer tester An integrated circuit is the integration of multiple electronic components (e.g., transistors, resistors, capacitors, etc.) on a single semiconductor material to form a fully functional circuit. A chip, on the other hand, is an integrated circuit fabricated on a silicon wafer to form a complete electronic device.

The difference between a chip and an integrated circuit is the difference in emphasis of expression. Chip generally refers to the naked eye can see the growth of a lot of small feet or feet can not be seen, but it is obvious that the square piece of stuff; however, the chip also includes a variety of chips, such as baseband, voltage conversion and so on. And integrated circuits refers to the composition of the circuit active devices, passive components and their interconnections are made together on a semiconductor substrate or insulating substrate to form a structurally tightly linked, internally related instances of electronic circuits.wafer probe testing It can be divided into semiconductor integrated circuits, membrane integrated circuits, hybrid integrated circuits three main branches. Wide range, some resistors capacitors diodes integrated together even if it is an integrated circuit, may be a piece of analog signal conversion chip, may also be a piece of logic control chip.

In addition, chips and integrated circuits are made in different ways. Chips use single-crystal silicon wafers as the base layer,vibration isolation table and then use photolithography, doping, CMP and other technologies to make components such as MOSFETs or BJTs, and then use thin-film and CMP technologies to make wires, and so on to complete the chip production. Integrated circuits, on the other hand, use a certain process to interconnect the transistors, resistors, capacitors, inductors, and other components and wiring required for a circuit, and produce them on a small semiconductor wafer or dielectric substrate or several small pieces of wafer, and then encapsulate them in a tube housing.

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